Next Generation Embedded Computing
ERiS Module
A compact, high-performance System-on-Module engineered for robotics, industrial automation, edge AI and intelligent embedded applications.
ERiS Module
•
System on Module
•
50 mm × 50 mm
Technical Specifications
Built for intelligent machines.
01 — PROCESSOR
STMicroelectronics
STM32MP257DAK3 Processor
02 — COMPUTE
1.5 GHz Processing Performance
Dual ARM Cortex-A35 and
400 MHz Cortex-M33 Cores.
03 — AI & GRAPHICS
Neural Processing Unit + 3D GPU
Neural Processing Unit (NPU)
operating at up to 1.35 TOPS,
with integrated 3D GPU.
04 — MEMORY & STORAGE
1 GB to 4 GB LPDDR4
Up to 32 GB eMMC storage.
05 — POWER
STPMIC25APQR Power Management IC
Integrated power management
for reliable and efficient
system operation.
06 — EXPANSION
200-Pin Board-to-Board Extension
High-density board-to-board
interface for flexible carrier
board integration.
07 — ENVIRONMENT
−40°C to +85°C Operating Temperature
Supports working temperatures
ranging from −40°C to +85°C.
08 — SOFTWARE & CUSTOMIZATION
Customized Linux - EchoLinux
Supports customized Linux - EchoLinux with
a custom carrier board as per
application requirements.
Contact Us
Let's build the future.
Email
elevenrobotix@gmail.com
Phone
+91 7709096410
ERiS System on Module
The next generation starts here.
ERiS is being engineered for developers, robotics companies, OEMs and innovators building the intelligent machines of tomorrow.
Coming Soon